Electrothermal Analysis of Vlsi Systems,9780792378617

Electrothermal Analysis of Vlsi Systems

by ; ; ;
ISBN13: 9780792378617
ISBN10: 079237861X
Format: Hardcover
Pub. Date: 2000-05-01
Publisher(s): Kluwer Academic Pub
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Summary

Electrothermal Analysis of VLSI Systems addresses electrothermal problems in modern VLSI systems. Part I, The Building Blocks, discusses electrothermal phenomena and the fundamental building blocks that electrothermal simulation requires (including power analysis, temperature-dependent device modeling, thermal/electrothermal simulation, and experimental setup-calibration). Part II, The Applications, discusses three important applications of VLSI electrothermal analysis including temperature-dependent electromigration diagnosis, cell-level thermal placement and temperature-driven power and timing analysis. Electrothermal Analysis of VLSI Systems will be useful for researchers in the fields of IC reliability analysis and physical design, as well as VLSI designers and graduate students.

Table of Contents

List of Figures
ix
List of Tables
xv
Preface xvii
Acknowledgments xxi
Part I THE BUILDING BLOCKS
Introduction
3(18)
Electrothermal Phenomena in VLSI Systems
4(1)
Introduction to Electrothermal Simulation
5(7)
Overview of Electrothermal Simulation for ICs
6(6)
ILLIADS-T: An Electrothermal Simulator for VLSI Systems
12(3)
Overview of this Book
15(6)
Power Analysis for CMOS Circuits
21(24)
Introduction
21(1)
Sources of Power Consumption in CMOS Technology
21(7)
Dynamic Power
22(1)
Internal Power
23(1)
Short-Circuit Power
24(1)
Leakage Power
25(3)
Power Analysis Overview
28(1)
Introduction to Power Analysis Techniques
29(10)
Deterministic Power Analysis
29(1)
Probabilistic Power Analysis
30(3)
Statistical Power Analysis
33(4)
Power Analysis for Sequential Circuits
37(2)
Summary
39(6)
Temperature-Dependent MOS Device Modeling
45(16)
Introduction
45(1)
Temperature-dependent Device Physics and Modeling
46(2)
Temperature-dependent Threshold Voltage
46(1)
Temperature-dependent Carrier Mobility
47(1)
Temperature-dependent BSIM Model for SPICE Simulation
48(3)
Regionwise Quadratic (RWQ) Model
51(6)
Temperature-dependent Mobility Modeling
53(1)
μ0(T) Extraction for RWQ Modeling
54(1)
Mobility and RWQ Fitting Examples
54(3)
Summary
57(4)
Thermal Simulation for VLSI Systems
61(34)
Introduction
61(3)
Substrate/Package Modeling: An Overview
64(1)
Formulation of Thermal Analysis
65(18)
Fast Thermal Analysis
65(7)
Numerical Approach
72(7)
Analytical Approach
79(3)
Discussion
82(1)
Package Simulation
83(5)
Modeling of the Convective Boundaries
83(1)
Modeling of Heat Flow Paths
84(4)
Summary
88(7)
Fast-Timing Electrothermal Simulation
95(26)
Introduction
95(1)
ILLIADS: A Fast Timing Simulator
96(5)
Primitive Formation and Solutions
96(2)
Simulation Strategies
98(3)
Power Estimation using ILLIADS
101(1)
Incremental Electrothermal Simulation in ILLIADS-T
101(2)
Tester Chip Design and Calibration
103(2)
Verification of ILLIADS-T
105(7)
ILLIADS-T Simulation Examples
112(4)
Summary
116(5)
Part II THE APPLICATIONS
Temperature-Dependent Electromigration Reliability
121(36)
Motivation
121(1)
Electromigration (EM) Physics
122(7)
EM Lifetime Dependence on Current Density
123(1)
EM Lifetime Dependence on Current Waveforms
124(3)
EM Lifetime Dependence on Interconnect Width and Length
127(2)
EM Model Used in the Book
129(1)
EM Simulation: An Overview
129(4)
iTEM: A Temperature-dependent EM Diagnosis Tool
133(15)
Interconnect Temperature Estimation
133(2)
Analytical Model of Interconnect Thermal System
135(1)
Lumped Model of Interconnect Thermal System
136(7)
iTEM Simulation Examples
143(5)
Summary
148(9)
Temperature-Driven Cell Placement
157(24)
Introduction
157(1)
Overview
157(3)
Substrate Temperature Calculation
160(1)
Compact Substrate Thermal Modeling
161(4)
Transfer Thermal Resistance Matrix
161(2)
Admittance Matrix Reduction
163(1)
Runtime Efficiency of Compact Thermal Modeling
164(1)
Thermal Placement Algorithms
165(4)
Standard Cell Thermal Placement
165(3)
Macrocell Thermal Placement
168(1)
Simulation Examples
169(3)
Summary
172(9)
Temperature-Driven Power and Timing Analysis
181(24)
Introduction
181(1)
Timing Analysis Overview
182(9)
Dynamic Timing Analysis
182(1)
Static Timing Analysis
183(7)
Delay Modeling
190(1)
Statistical Power Density Estimation
191(1)
Monte-Carlo Power-Temperature Iteration Scheme
192(2)
Temperature-dependent Gate and RC Delays
194(1)
Simulation Examples
194(5)
Summary
199(6)
Index 205

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